Ultratech Ships 50th Laser Spike Anneal System To A Major Asian Foundry
Ultratech's LSA Tools Enable Higher Performance and Lower Leakage for High-end Mobile Devices
SAN JOSE, Calif., June 20, 2012 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced the shipment of its 50th laser spike anneal (LSA) system. Among these 50 systems, Ultratech has shipped more than 15 of its flagship LSA101 systems, which can achieve throughputs of up to 60wph. Ultratech's unique long-wavelength LSA technology enables higher performance and lower leakage for today's high-end smartphones and media tablets, and is the process tool of record at all major foundries for production of leading-edge devices.
Arthur W. Zafiropoulo, Chairman and Chief Executive Officer, noted, "The shipment of our 50th LSA system to a major Asian foundry demonstrates the positive results of our focus on delivering outstanding products and services to our customers worldwide. Utilized by leading IDMs and foundries around the globe, LSA is now implemented as the preferred technology for high-volume manufacturing of advanced logic devices from the 45- to 28-nm nodes. As the industry continues to move to sub-28-nm nodes, Ultratech is strategically positioned to meet its customers' advanced processing needs. We expect that there will be additional process steps requiring LSA technology as devices scale down, which puts the product in a strong position for long-term growth. As we mark the shipment of our 50th LSA system, we look forward to working with existing and new customers around the world in developing advanced technology that provides significant competitive advantages."
The LSA101 enables critical millisecond annealing applications for the 28-nm node and below compared to other competing millisecond annealing technologies. The LSA101 delivers superior within-die uniformity, layout-independent process results, and real-time closed-loop temperature control over the entire wafer. The system has a minimum dwell time of 200 microseconds, which minimizes overlay errors for devices with aggressive strain engineering. This reduced dwell time capability, along with excellent process control, allows customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and improved yield. Finally, with a maximum throughput of 60wph the LSA101 is an example of Ultratech's commitment to continue to develop advanced technology systems that provide economic advantages to its global customers.